Materials & Manufacturing

Brazing

/bray-zing/
A metal-joining process in which a filler alloy with a melting point above 450 °C is heated to flow by capillary action into the gap between closely fitted surfaces, creating a strong, gas-tight, electrically conductive joint without melting the base metals. In RF manufacturing, brazing assembles hermetic cavity packages, bonds ceramic feedthroughs to Kovar housings, joins waveguide sections, and creates the high-reliability metallic seals that protect sensitive MMIC and SAW filter dies from moisture and contamination.
Category: Materials & Manufacturing
Temp Range: 280 to 1100 °C
Leak Rate: < 1e-8 atm-cc/s He

Understanding Brazing

Brazing differs from welding in that the base metals are never melted, and from soldering in that the filler melts above 450 °C. The joint forms by capillary action: the liquid filler is drawn into the narrow gap (typically 25 to 75 micrometers) between the parts, wetting both surfaces and solidifying into a metallurgical bond. The capillary gap must be tightly controlled; too wide and the filler won't bridge the gap, too narrow and it can't flow in. For RF packages, joint gaps are held to plus or minus 10 micrometers by precision fixturing.

The choice of brazing atmosphere is critical. Any oxide on the base metal or filler prevents wetting and creates voids. Vacuum brazing (below 10 to the negative 4th torr) eliminates oxygen entirely, producing the cleanest joints. Hydrogen atmosphere brazing actively reduces existing oxides. For RF hermetic packages, vacuum brazing is standard because flux residues trapped inside a sealed cavity cause long-term outgassing and corrosion that degrade device reliability over the 20-year service life required by space and defense programs.

Process Parameters

Capillary Joint Gap:
Optimal gap = 25 to 75 µm (0.001 to 0.003 in)

Braze Atmosphere Requirements:
Vacuum: < 1 × 10−4 torr | H2: dew point < −40 °C

Hermetic Leak Rate (MIL-STD-883 Method 1014):
Pass: < 1 × 10−8 atm-cc/sec He (fine leak)
Pass: no bubble at 1 atm (gross leak)

Joint gap tolerance of ± 10 µm is maintained by precision graphite or ceramic fixtures.

Brazing Process Comparison

ProcessAtmosphereTemp RangeThroughputJoint QualityRF Application
Vacuum Furnace< 1e-4 torr280 to 1100 °CBatch (10 to 100 units)Excellent (void-free)Hermetic packages, waveguide
Hydrogen FurnaceDry H2600 to 1100 °CContinuous beltVery goodHigh-volume packages
InductionN2 or vacuum280 to 900 °CSingle pieceGoodConnector assemblies
TorchLocal (flux)600 to 1100 °CManualVariableWaveguide repair, prototypes
Common Questions

Frequently Asked Questions

Why is atmosphere control critical?

Oxide layers prevent wetting and create voids that compromise hermeticity. Vacuum brazing (< 1e-4 torr) removes oxygen entirely; hydrogen reduces existing oxides. Flux residues inside sealed cavities cause outgassing and corrosion, so flux-based brazing is avoided for RF hermetic packages. Vacuum brazing is the standard for space and defense applications.

What is step brazing?

Sequential assembly at progressively lower temperatures so each step doesn't remelt previous joints. Typical RF cavity sequence: feedthrough at 780 °C (CuAg), internal partition at 700 °C (AuCu), die attach and lid seal at 280 °C (AuSn). Each alloy needs 30 to 50 °C margin below the previous step's solidus.

How is joint quality verified?

Helium fine leak test per MIL-STD-883 (pass: < 1e-8 atm-cc/s). Visual inspection for fillet formation. X-ray for internal voids. Scanning acoustic microscopy (SAM) maps void percentage across die-attach joints, with a < 5 percent requirement for high-reliability applications.

RF Package Assembly

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