Active Components

Active Bias

A Class AB power amplifier's linearity depends on its quiescent current sitting at a precise value: too high and it wastes power like Class A; too low and crossover distortion spikes. A simple resistive voltage divider cannot hold that current steady because the transistor's threshold voltage drifts with temperature. At +85°C, a GaAs pHEMT's Vth has shifted by 100 mV and the quiescent current has risen 25%. An active bias circuit uses a current mirror or feedback loop with a temperature-tracking reference transistor to cancel this drift, holding Idq within ±5% from −40°C to +85°C.
Category: Active Components
Idq Stability: ±5% over temperature
Key Challenge: Vth drift (−1 to −2 mV/°C)

When Resistors Are Not Enough

Bias Approach Comparison

ApproachIdq Stability (−40 to +85°C)Supply RejectionComplexityBest For
Resistive divider±15 to 30%Poor2 resistorsNon-critical, fixed VDD
Self-bias (source resistor)±10 to 20%Moderate1 resistorSmall-signal, Class A
Current mirror±3 to 7%GoodMirror FET + RrefMMIC integration, PA
Feedback with op-amp±1 to 3%ExcellentOp-amp + sense RHigh-reliability, base station
Digital DAC control±0.5 to 1%ExcellentDAC + ADC + MCUAdaptive bias, DPD systems

GaN-Specific Bias Challenges

  • Negative gate voltage: GaN HEMTs are depletion-mode (Vth = −2 to −3 V). The gate supply is typically generated by a charge pump or inverter from the positive drain supply.
  • Power-up sequencing: The negative VGS must be applied before VDS. Without this, the device conducts at full IDSS and the inrush current can destroy it. Sequencing circuits add 2 to 5 ms of controlled ramp time.
  • Current collapse: Trapping effects in the GaN buffer layer cause Idq to drop after RF stress. Active bias circuits must monitor and compensate for this drift in real time.
  • Self-heating: GaN devices run at junction temperatures of 150 to 200°C. The bias circuit must track this extreme temperature, not the ambient.
Common Questions

Frequently Asked Questions

Why not use a resistive divider?

A resistive divider does not compensate for Vth drift (−1 to −2 mV/°C). Over −40 to +85°C, quiescent current can shift 15 to 30%, pushing Class AB toward Class A at hot temperatures and Class B at cold. Active bias holds Idq within ±5%.

How does a current mirror work for RF?

A reference transistor matched to the RF device establishes a stable current through a precision resistor. The mirror transistor replicates this to the RF device's gate. Both transistors track temperature equally, cancelling Vth drift. Best tracking requires the reference FET on the same die or package.

What is special about GaN biasing?

GaN HEMTs need negative gate voltage (generated by a charge pump), strict VGS-before-VDS sequencing (or the device self-destructs), and compensation for current collapse (trap-induced Idq droop after RF stress).

Bias Design

GaN Sequencing and Protection Reference Design

Complete schematic, BOM, and layout files for a GaN HEMT bias controller with negative voltage generation, power-up sequencing, Idq monitoring, and over-temperature shutdown.

View Reference Design