Active Bias
When Resistors Are Not Enough
Bias Approach Comparison
| Approach | Idq Stability (−40 to +85°C) | Supply Rejection | Complexity | Best For |
|---|---|---|---|---|
| Resistive divider | ±15 to 30% | Poor | 2 resistors | Non-critical, fixed VDD |
| Self-bias (source resistor) | ±10 to 20% | Moderate | 1 resistor | Small-signal, Class A |
| Current mirror | ±3 to 7% | Good | Mirror FET + Rref | MMIC integration, PA |
| Feedback with op-amp | ±1 to 3% | Excellent | Op-amp + sense R | High-reliability, base station |
| Digital DAC control | ±0.5 to 1% | Excellent | DAC + ADC + MCU | Adaptive bias, DPD systems |
GaN-Specific Bias Challenges
- Negative gate voltage: GaN HEMTs are depletion-mode (Vth = −2 to −3 V). The gate supply is typically generated by a charge pump or inverter from the positive drain supply.
- Power-up sequencing: The negative VGS must be applied before VDS. Without this, the device conducts at full IDSS and the inrush current can destroy it. Sequencing circuits add 2 to 5 ms of controlled ramp time.
- Current collapse: Trapping effects in the GaN buffer layer cause Idq to drop after RF stress. Active bias circuits must monitor and compensate for this drift in real time.
- Self-heating: GaN devices run at junction temperatures of 150 to 200°C. The bias circuit must track this extreme temperature, not the ambient.
Frequently Asked Questions
Why not use a resistive divider?
A resistive divider does not compensate for Vth drift (−1 to −2 mV/°C). Over −40 to +85°C, quiescent current can shift 15 to 30%, pushing Class AB toward Class A at hot temperatures and Class B at cold. Active bias holds Idq within ±5%.
How does a current mirror work for RF?
A reference transistor matched to the RF device establishes a stable current through a precision resistor. The mirror transistor replicates this to the RF device's gate. Both transistors track temperature equally, cancelling Vth drift. Best tracking requires the reference FET on the same die or package.
What is special about GaN biasing?
GaN HEMTs need negative gate voltage (generated by a charge pump), strict VGS-before-VDS sequencing (or the device self-destructs), and compensation for current collapse (trap-induced Idq droop after RF stress).